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Power chips are connected to outside circuits via product packaging, and their efficiency depends upon the support of the packaging. In high-power situations, power chips are generally packaged as power modules. Chip affiliation refers to the electrical connection on the top surface area of the chip, which is normally light weight aluminum bonding wire in traditional modules. ^
Traditional power component plan cross-section

Presently, business silicon carbide power components still mainly make use of the packaging innovation of this wire-bonded conventional silicon IGBT component. They deal with problems such as big high-frequency parasitic parameters, not enough heat dissipation capability, low-temperature resistance, and insufficient insulation toughness, which limit making use of silicon carbide semiconductors. The display screen of excellent performance. In order to solve these issues and completely exploit the significant possible advantages of silicon carbide chips, many brand-new packaging innovations and remedies for silicon carbide power modules have actually emerged over the last few years.

Silicon carbide power component bonding method


(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have created from gold wire bonding in 2001 to light weight aluminum cable (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually established from gold wires to copper cords, and the driving pressure is expense reduction; high-power gadgets have actually developed from aluminum cords (strips) to Cu Clips, and the driving pressure is to boost item efficiency. The greater the power, the higher the needs.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that makes use of a strong copper bridge soldered to solder to connect chips and pins. Compared to standard bonding product packaging methods, Cu Clip technology has the adhering to advantages:

1. The link between the chip and the pins is made from copper sheets, which, to a certain level, replaces the standard cable bonding approach between the chip and the pins. Therefore, a distinct package resistance value, higher existing circulation, and far better thermal conductivity can be acquired.

2. The lead pin welding area does not need to be silver-plated, which can fully conserve the price of silver plating and inadequate silver plating.

3. The item look is entirely regular with regular products and is mostly made use of in web servers, portable computers, batteries/drives, graphics cards, electric motors, power materials, and other fields.

Cu Clip has 2 bonding methods.

All copper sheet bonding technique

Both eviction pad and the Resource pad are clip-based. This bonding approach is a lot more pricey and complex, but it can accomplish far better Rdson and better thermal results.


( copper strip)

Copper sheet plus cord bonding method

The resource pad makes use of a Clip method, and the Gate utilizes a Wire method. This bonding technique is a little cheaper than the all-copper bonding approach, saving wafer area (appropriate to really little entrance areas). The process is easier than the all-copper bonding approach and can get better Rdson and better thermal impact.

Vendor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper utensils, please feel free to contact us and send an inquiry.

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